To process the WGR, the grooving machine is the core processing equipment in the slicing?process of silicon wafers. Gaoce WGR grooving machine GC-LMKC01 adopts a high-performance?ultrafast laser system. With a smaller heat affected zone, the laser cutting is a non-contact?processing method reducing the radial pressure on the WGR, effectively improving the grooving?accuracy and meeting the high-precision requirements of WGR grooving during silicon wafer?slicing. It can meet the different types and process requirements of ultra-fine diamond wire for?the WGR grooving, which can further improve the slicing yield of silicon wafers.