GC-SEWS824 Semiconductor Single-wire Cropper
This product is a special equipment?for cutting semiconductor monocrystalline?silicon rods. It can process?silicon rods with diameter of 8~24?inches and maximum processing?length of 2600mm. This equipment?uses diamond wire for cutting,?removing head/tail, and cutting of?samples, with characteristics of high?cutting efficiency and good section?quality.
Product Parameters
|
Machine profile |
Equipment Size |
About.5000mm×2560mm×2740mm?(LxWxH) |
Equipment Weight |
About.5500kg |
|
|
Specification of silicon rod |
Length of Silicon Rod |
300~2000mm?(excluding head/tall, cutting from head to tail without?reversing) |
Diameter of Silicon Rod |
φ200~φ600mm |
|
Processing Quantity |
1?piece/block |
|
Segment Length |
150mm~400mm (manual cutting?for those below 300mm) |
|
Number of Cutting |
1?Knife edge/knife |
|
Sample Thickness |
2～15mm |
|
|
Cutting system |
Feeding Drive |
Servo motor, lead screws lifting |
Moving Speed of Cutting Head |
0～900mm/min, no grade for adjustment |
|
Cutting Feed Speed |
0~20mm/min?(set based on diameter of silicon rod) |
|
Diameter of Cutting Wire |
φ0.42mm |
|
Cutting Time |
Complete one cut of 18”?silicon rod within 90 minutes in average (adjustable depending on the cutting quality) |
|
Cutting tension |
Tension of Cutting Wire |
0～120N |
|
Equipment system |
Power Supply?for bus |
380V±10%AC,50Hz±1Hz |
Power Load |
14KVA |
?
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