Grinding Wheels for Cylindrical Grinding of Semiconductor Ingots
Mainly used for cylindrical grinding of various sizes of semiconductor silicon rods, high?speed, efficient, accurate, material removal, high accuracy, long service life.
Product Parameters
Shape code |
Conventional specification/mm |
|||
Diameter, D |
Thickness,?T |
Aperture, H |
Grooved,?G |
|
1A1 |
350 |
35~100 |
127 |
100#~600# |
1A1 |
400 |
50~150 |
203 |
100#~600# |
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