GC-BG202HAutomatic Grinder
This series of grinder is mainly designed for thinning of hard and?brittle materials. It adopts In-feed processing principle, and the?rotating wafer is ground through the rotation of grinding wheel and?vertical feed. This model of grinder is optimized with high rigidity,?suitable for efficient and high-precision processing of silicon carbide?wafers in addition to using in wafer processing.?
Product Parameters
1.?Basic specifications |
|
Wafer processing size |
8 inch, 6 inch |
Wafer processing thickness |
0.1mm~1mm |
Grinding principle |
In-feed |
Grinding wheel size |
12 inch (300mm) |
Grinding mode |
Auto/manual |
Quantity of material boxes |
2 (compatible with 8 inch, 6 inch) |
Processing sides |
Single/double-sided thinning (selection via program) |
Weight |
9500KG |
Dimensions |
3050x1495x2180 |
2.?Specifications of spindle |
|
Number of spindles |
2 (Z1, Z2) |
Form of spindle bearing |
Air bearing |
Motor power of spindle |
11KW |
Rotation speed of spindle |
1000rpm~3000rpm (Z1/Z2 can be set separately for the process) |
3.?Specifications of Z-axis (Z1/Z2) |
|
Travel of Z-axis |
150mm |
Speed of Z-axis |
0.0001~0.08 mm/s |
Maximum speed of Z-axis |
50 mm/s |
Minimum movement distance of Z-axis |
0.1 μm |
Resolution of Z-axis |
0.1 μm |
4.?Specifications of wafer table |
|
The numbers of wafer table |
3 ??(A、B、C） |
Form of wafer table bearing |
Air bearing |
Wafer adsorption on table |
Vacuum adsorption (the equipment is equipped with vacuum system) |
Speed of wafer table |
0~500rpm (set separately for each wafer table) |
Switching mode of wafer table |
Air turntable |
Cleaning method for tablet table |
Oilstone/two-fluid/brush |
Related Products
Sustainable Development
Related Solutions
Get Quote
Fill in a brief message and we will contact you as soon as possible~